LG Innotek announced on the 10th that it has successfully developed a ‘next-generation smart IC (integrated circuit) substrate’ that enhances performance while reducing carbon emissions by half ...
On October 2, Meta announced the acquisition of US-based IC design company Rivos, which develops high-performance computing chips and solutions based on the RISC-V architecture. Interestingly, at the ...
Rising memory prices are creating fresh cost challenges for IC design firms, particularly those producing chips with embedded ...
TAIPEI, Taiwan — China launched two probes targeting the U.S. semiconductor sector Saturday ahead of talks between the two nations in Spain this week on trade, national security and the ownership of ...
The Global Electronics Association has published a new international standard, IPC‑6921, for organic IC substrates.
PSD@5KM+ expands ecosystem with co-working and talent development; 2nd batch of tech collaborators onboarded to expand IC ...
A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.
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